Surface modification by ultra-fine bubbles (UFB)
and its application
In the material removal process, the properties of the outermost surface of the material to be removed are extremely important. In other words, if the properties of the outermost surface of the material can be appropriately controlled (modified) according to the processing method, many benefits can be expected, such as improved material removal efficiency and reduced damaged layers.
In this regard, our laboratory is trying to develop a process that enables surface modification of various materials such as semiconductor substrates by using the unique properties of ultra-fine bubbles (UFB). In addition to “machining”, basic research to apply UFB to “sterilization, biofilm removal” and “plant growth” is also being conducted.
Hiroko Yamada, Kensuke Konishi, Keita Shimada, Masayoshi Mizutani,
and Tsunemoto Kuriyagawa